current position:Home > Water purification equipment > Ultra-pure water equipment, deionized pure water equipment > Circuit board PCB deionized water equipment
Circuit board PCB deionized water equipment
Name: Circuit board PCB deionized water equipment
Water inlet diameter: 15-100 (mm)
Water production: 0.25-50t / h
Working pressure: 1.5MPa (psi)
In the process of circuit board production, most of the processes of FPC / PCB wet process are similar. The requirements for pure water in each process are similar. The electroplated copper, tin, nickel-gold, electroless nickel-plated gold, PTH / black hole, surface treatment etching and other production processes that we commonly use in the production of circuit boards require pure water with different requirements. Because different medicines are used in the production of circuit boards, the production process is different, and the quality requirements for pure water are also different. The most critical indicators are: electrical conductivity (resistivity), total silicon, pH, particle size. The pure water used for circuit boards and circuit boards is different from the pure water manufacturing process because of its own process flow. According to the current use of most circuit board factories, it is roughly divided into the following three types: pretreatment plus ion exchange pure water system; reverse osmosis plus ion exchange system; high efficiency reverse osmosis EDI ultra pure water equipment .
The necessity of choosing deionized water equipment:
The deionized water plays an increasingly important role in the electronics industry, mainly in the production of circuit boards and electronic components. Deionized water quality has become one of the important factors affecting the quality of circuit boards, electronic component products, production yield and production costs. Water quality The requirements are also getting higher and higher. In the production of electronic components, deionized water is mainly used as cleaning water and used to prepare various solutions and slurries. The use of pure water and the requirements for water quality in different electronic component production are also different.
In the production of transistors and integrated circuits, deionized water is mainly used for cleaning silicon wafers, and a small amount is used for the preparation of chemical liquids, water vapor sources for silicon wafer oxidation, cooling water for some equipment, and preparation of plating solutions. 80% of the processes in the integrated circuit production process require the use of high-purity water to clean the silicon wafer. The quality of the water has a great relationship with the product quality and production yield of the integrated circuit. Alkali metals (K, Na, etc.) in water will cause poor withstand voltage of the insulation film, heavy metals (Au, Ag, Cu, etc.) will reduce the PN junction withstand voltage, and group III elements (B, Al, Ga, etc.) will make N type Deterioration of semiconductor characteristics. Group V elements (P, As, Sb, etc.) will deteriorate the characteristics of P-type semiconductors. Phosphorus (about 20-50% of ash content) after high-temperature carbonization of bacteria in water will cause localized areas on P-type silicon wafers. It becomes N-type silicon and causes the performance of the device to deteriorate. If particles (including bacteria) in the water are adsorbed on the surface of the silicon wafer, it will cause a short circuit or deteriorate the characteristics.
Circuit board PCB deionized water equipment
Typical process flow:
1. The original water tank → booster pump → fully automatic multi-media filter → fully automatic activated carbon filter → fully automatic water softener → intermediate water tank → low pressure pump → precision filter → positive resin bed → negative resin bed → Yin-yang resin mixed bed → microporous filter → water point 2. Two-stage reverse osmosis raw water tank → booster pump → fully automatic multi-media filter → fully automatic activated carbon filter → fully automatic water softener → precision filter → First-level reverse osmosis device → PH adjustment → Secondary reverse osmosis host → Pure water tank → Pure water pump → Micro-pore filter → Water point 3. Use the first-grade reverse osmosis plus EDI method ,
Raw water tank → Booster pump → Full-automatic multi-media filter → Full-automatic activated carbon filter → Full-automatic water softener → Precision filter → Primary reverse osmosis device → Intermediate water tank → EDI water pump → EDI system → Micropore filter → Water outlet standard:
Conforms to American ASTM standards, and complies with "National Standard for Ultrapure Water in China Electronics Industry" GB / T1146.1-1997